Key Features
Superior Performance
OpenPOWER9 LaGrange CPU, 2 Sockets up to 44 cores(2.9Ghz) and 176 threads
Ultra high CPU interconnect bandwidth
Next Gen PCIe - PCIe Gen4 2x faster vs PCIe Gen3
Optimized for Heterogeneous computing
NVLink2.0 - higher bandwidth and lower latency for GPU to CPU
OpenCAPI - higher bandwidth and lower latency for FPGA/ASIC to CPU
Optimized for memory computing
Up to 16 memory channels offering higher bandwidth
Up to 32 DDR4-2666 DIMM Slots offering max 4TB capacity
High cost performance
Low TCO through system optimization of cooling and power supply, industry standardization and more flexible service and support
Technical Specifications
Product Model | Inspur Power Systems FP5290G2 |
Processor |
OpenPOWER9 LaGrange CPU ,2 Sockets, up to 2.9GHz, 225W up to 22 cores enabled on a single chip , each core supports 4 threads |
Memory |
32 DDR4 DIMM slots, Supports RDIMM/LRDIMM, speeds up to 2666, 4TB max |
Drive Bays |
Front drive bays: 12 x 3.5” SAS/SATA/U.2 NVMe HDD drives (up to 4NVMe SSDs ) Internal drive bays: 2 x M.2 SSD |
Network Ports |
On-board: 2 x 1GE Options: 1GE/10GE/25GE/40GE/100GE or 100Gb EDR IB |
PCIe Expansion |
Up to 10 PCIe slots (4 x PCIe4.0 + 6 x PCIe3.0) |
Acceleration Ports |
2 x NVLink2.0 or OpenCAPI |
RAID |
|
Ports |
Front ports: 1 x VGA, 2 x USB 3.0 Rear ports: 1xVGA, 1x serial, 2 x USB 3.0, IPMI Manager network port |
Fan Modules |
6 hot-swappable counter-rotating fan modules with optional N+1 redundancy |
Power |
Platinum 800W, 1300W, 1600W, 2000W, 2 Hot plug power supplies with redundancy |
OS |
Red Hat Enterprise Linux、Ubuntu、NeoKylin |
Chassis |
436mm×86mm×826mm |
Weight |
<33kg |
Operating Temperature |
5℃ to 35℃ (41℉ to 95℉) |