Inspur i24LM6

i24LM6 is Inspur’s latest 2U-4Node liquid cooled rack server optimized for high density datacenter and HPC,with flexible configuration of air and liquid cooling. It is suitable for a wide variety of compute-intensive workloads including HPC, high-performance data analytics and more. With industry’s first support of 3rd Gen Intel® Xeon® Scalable processors, the liquid cooling design of CPU, DIMM and VR are fully optimized to deliver unmatched compute and cooling performance. Based on i24LM6,Inspur launches the unique Air/Liquid Cooling CDU solution to help quickly deploy liquid cooling without upgrading original facilities, greatly increase deployment efficiency and reduce operational costs.

Extreme Performance

  • 4 2-socket compute nodes in 2U Chassis, with 8 Intel Ice Lake processors, achieving industry highest density.
  • 5% performance improvement with liquid cooling
  • 16 3200MT/s DIMMs in each node, meeting the needs of high-density computing and large-capacity memory

HIntelligent Maintenance

  • Node-level water leakage detection, leakage node can be located accurately and powered off automatically, effectively reducing risks
  • The cabinet integrates dynamic environment monitoring devices to monitor temperature, humidity and leakage information in real time, achieving intelligent maintenance

High Efficiency Liquid Cooling

  • Warm water cooling, up to 80% heat to water ratio
  • Water cooling covers CPU/DIMM/VR, PUE≤1.1
  • Less cooling devices deployment in data center, significantly reducing cooling costs

Flexible Deployment

  • Two kinds of pipes (hose and metal) to choose, covering different customer demands
  • Exclusive air-liquid CDU solution, quickly deploying liquid-cooled system without data center modification. Together with the large-scale liquid-liquid cluster solution, covering all application scenario demands of customers


Chassis Model


Form Factor

2U 4-Node


Conf.1: 24*2.5” NVMe

Conf.2: 16*2.5” SAS/SATA/NVMe+8*2.5” SAS/SATA

Conf.3: 12*3.5” SAS/SATA


2*2000W 80Plus Platinum hot-swap PSU, support DPC, optional 1+1 redundancy


Chassis: 4*80mm system fan, N+1 Redundant

Node: Liquid cooling

Operating Temperature

5℃-35℃/45°F - 95°F

Node Model


Form Factor

1U, 2-Socket Compute Node


2*3rd Gen Intel® Xeon® Scalable processor, TDP 270W


Conf.1: 4*2.5” SAS/SATA/NVMe + 2*2.5” SAS/SATA

Conf.2: 6*2.5” NVMe

Conf.3: 3*3.5” SAS/SATA



16*DDR4 3200MHz RDIMM/LRDIMM, up to 2TB

I/O Expansion

1*PCIe 4.0 x16 slot

1*OCP3.0 Card, support NCSI

1*RAID card



Inspur i24LM6